The IMSEAM cleanroom is a 227 m2 facility for device fabrication and patterning. It includes an ISO class 8 room, two ISO class 7 labs and one large ISO class 5 section for photo- and electron-beam lithography. The cleanroom is managed by S. Kauschke.
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Characterization & Spectroscopy Equipment
This 50 m2 ultrafast optical spectroscopy laboratory features dedicated setups for broadband transient absorption and fluorescence measurements of any condensed-phase sample with a time resolution of 100 fs on time scales from few ps to ms.
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The infrared (IR) scattering-type scanning near-field optical microscope neaSNOM provides state-of-the-art laterally resolved (10 -100 nm) IR spectroscopy. The IR-SNOM is ideal to characterize thin organic films and blends.
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Rigaku SmartLab is a high-resolution X-ray diffractometer with a high-flux 9 kW X-ray source coupled with a large 2D semiconductor detector that supports 0D, 1D and 2D measurement modes. Thin films as well as powders can be characterized.
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The ESCALAB 250Xi Photoelectron Spectrometer enables ultra-violet photoemission spectroscopy (UPS, energy resolution 100 meV), X-ray photoemission spectroscopy (XPS, energy resolution <0.45 eV), angle-resolved XPS/UPS, and XPS depth profiling.
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The ZEISS Axio Imager Z1 is an upright microscope with a motorized stage for advanced materials research. Transillumination (bright field or polarized), dark field epi-illumination (polarized), and epifluorescence (various excitation wavelengths) imaging are possible.
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The Quantachrome Autosorb IQ3 is a gas sorption analyzer that can measure gas isotherms on three independent sample stations simultaneously in a temperature range from 20 to 320 K. It is used to investigate porous materials with regard to specific surface area, pore volume, pore size distribution.
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The Dektak XT (Bruker) is a profilometer for measuring surface topography and film thicknesses. Surface (line)-profiles with a height resolution below 1 nm are possible.
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The parylene deposition system enables preparation of uniform and pin-hole free parylene films (nm - μm thickness) via chemical vapour deposition on a wide range of substrates (e.g. for encapsulation).
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