Microfluidics is an emerging field and is finding use in various disciplines. Starting from understanding flow mechanisms, to the generation of synthetic cells based on droplet-based microfluidics, to complex organ-on-a-chip models.
At the newly established Microfluidic Core Facility (µFlu CF) at the Institute for Molecular Systems Engineering and Advanced Materials (IMSEAM) at the University of Heidelberg, we aim to provide this valuable tool to every interested research group in and around the Neuenheimer Feld.
In our µFlu CF, we will support researchers from the start by giving input to the project design, to the production of microfluidic chips up to conducting the experiments in our S1 and S2 Biosafety laboratories.
Additionally, we are offering an introduction to the microfluidic work flow, starting with soft lithography to the handling and usage of the microfluidic chips. These tasks can be fulfilled at the facility either independently or under supervision.
We have several instruments in our facility, which can be used to make microfluidic structures ranging from 5µm up to 3mm with different techniques. Hereby, we are not only concentrating on the generation of PDMS-based microfluidic chips, but also on the application of nested glass capillary-based devices.
Equipment:
Techniques:
For further questions and potential collaborations please contact microfluidics@imseam.uni-heidelberg.de.
In order to ensure successful execution and implementation of the projects, µFlu CF asks to be contacted in time to discuss the project. In this way, the projects can be completed successfully and in a timely manner. Together with the user, the project will be discussed in detail to define the important milestones and the final goal and to develop a cost estimate. To simplify the request, please fill in the document "Project description“ and bring it to the first appointment.
To schedule an appointment, please contact us directly by email or phone:
Dr. Sadaf Pashapour
microfluidics@imseam.uni-heidelberg.de
06221- 54 15726
INF 225, Rm. 03.363