The UHV magnetron sputter system (PREVAC) supports the deposition (RF and DC magnetron sputtering in sputter-down geometry) of dielectric and metallic layers on up to 4 inch substrates under HV/UHV-conditions, reactive sputtering of metal oxides and metal nitrides, co-deposition of metals and metal oxides as well as substrate cleaning with an ion gun. Substrates can be cooled or heated (up to 650 °C) during deposition. For questions, contact Olaf Skibbe.
