SUSS MicroTec Mask Aligner MA/BA6 Gen4

The mask aligner enables photolithography with feature sizes down to 0.6 μm. It is equipped with a 350 W mercury lamp in combination with a Micro Optics Exposure Optic® facilitating a very homogeneous exposure intensity over a 6" diameter exposure area. Photomasks from 2" to 6" can be used. The mask aligner supports different exposure modes (vacuum contact, hard contact, and soft contact). The alignment of several device layers can be carried out either manually or software-assisted and its accuracy is about 0.25 - 0.5 μm. For steep resist edges a removable i-line band pass filter is installed in the light path. Contact Kseniia Pavlova for introduction and training.